Abstract
A hydrogen hyperthermal neutral beam (HNB) generated by an inclined slot-excited antenna electron cyclotron resonance plasma source has been used to etch hydrogenated amorphous silicon (a-Si:H) and polycrystalline silicon (poly-Si) films. In this work, we present selective etching of a-Si:H with respect to poly-Si by hydrogen plasma and hydrogen HNB under various substrate temperatures, gas pressures, and bias voltages of the neutralizer. We have observed that the etch rate of a-Si:H is considerably higher than that of poly-Si. The etch rate is largely dependent upon the substrate temperature. In this experiment, the optimal substrate temperature for improving the etch rate is approximately at 150°C. The root mean square surface roughness of the etched material reaches a maximum at 150°C and decreases rapidly. The etch rate of poly-Si is not sensitive to changes in the experimental condition, such as the substrate temperatures and gas pressures. However, as the hydrogen HNB energy is increased, the etch rate of poly-Si also increases gradually. The hydrogen HNB energy contributes in improving the etch rate of a-Si:H and poly-Si films.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
