Abstract
Inductively coupled plasma etching of platinum with gas chemistries was examined. Plasma characteristics were investigated with increasing ratios using a Langmuir probe and a quadrupole mass spectrometer. The chemical reaction during the platinum etching was also examined from the chemical binding states of the etched surface by X‐ray photoelectron spectroscopy. Additional characterization employed a four‐point probe, thin‐film thickness measuring system, and scanning electron microscopy. The relationship between plasma characteristics and etch results with various mixing ratios was also studied. It was confirmed that small additions of oxygen into the gas mixtures lead to high selectivity and a good sidewall profile without a fence, also referred to as a bull‐ear. © 2000 The Electrochemical Society. All rights reserved.
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