Abstract
Pure Cu (99.99%) is processed by equal-channel angular pressing (ECAP) and by high-pressure torsion (HPT). The electrical resistivity aswell as the microhardness increases with an increase in the equivalent strain at an early stage of straining, but saturates to a steady state at theequivalent strains more than ³20. At the steady state, the samples processed by ECAP and HPT show a significant increase in the hardness(³270%) but little decrease in the electrical conductivity (³12%) when compared to the annealed state. Transmission electron microscopyconfirms that the microstructure does not change at the saturated level with further straining. Evolutions of hardness, electrical conductivity andmicrostructures are also investigated after post-HPT annealing. [doi:10.2320/matertrans.MD201109](Received June 30, 2011; Accepted August 9, 2011; Published September 21, 2011)Keywords: severe plastic deformation, equal-channel angular pressing, high-pressure torsion, ultrafine grain, electrical conductivity
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