Abstract

Titanium nitride (TiN) is a mechanically robust, high-temperature stable, metallic material receiving considerable attention for resilient plasmonics. In this work, the authors fabricated six heteroepitaxial TiN films on sapphire using controllably unbalanced reactive magnetron sputtering. They examined the effect of substrate growth temperature on the plasmonic and crystalline quality of the film. Optical properties of all films were obtained from spectroscopic ellipsometry; plasmonic quality factors were determined from the real and imaginary parts of the dielectric function. The authors determined crystallinity using x-ray diffraction and surface morphology using atomic force microscopy. X-ray diffraction showed (111) TiN peaks with Pendellösung fringes indicating consistent heteroepitaxy. Atomic force microscopy showed smooth surfaces with root mean square surface roughness ranging from 0.2 to 2.6 nm. Based on this characterization, the authors determined that the substrate deposition temperature of 550 °C yielded (111)-oriented heteroepitaxial TiN with minimal surface roughness. The authors found that 550 °C also gave highest plasmonic quality factors for all wavelengths, approaching the values of today's best plasmonic materials (such as Au and Ag). Further, the Q-factors at wavelength 1550 nm inversely correlated with calculated lattice constants. Their results indicate that the plasmonic response of TiN is directly linked with structural quality of the film.

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