Controlling electron and hole concentration in MoS2 through scalable plasma processes

Abstract

Conventional high-energy ion implant processes lack implant depth precision and minimally damaging properties needed to dope atomically thin two-dimensional (2D) semiconductors by ion modification without undesirable side effects. To overcome this limitation, controllable, reproducible, and robust doping methods must be developed for atomically thin semiconductors to enable commercially viable wafer-scale 2D material-based logic, memory, and optical devices. Ultralow energy ion implantation and plasma exposure are among the most promising approaches to realize high carrier concentrations in 2D semiconductors. Here, we develop two different plasma processes using commercially available semiconductor processing tools to achieve controllable electron and hole doping in 2H-MoS2. Doping concentrations are calculated from the measured Fermi level shift within the MoS2 electronic bandgap using x-ray photoelectron spectroscopy. We achieve electron doping up to 1.5 × 1019 cm−3 using a remote argon/hydrogen (H2) plasma process, which controllably generates sulfur vacancies. Hole doping up to 4.2 × 1017 cm−3 is realized using an inductively coupled helium/SF6 plasma, which substitutes fluorine into the MoS2 lattice at sulfur sites. The high doping concentrations reported here highlight the potential of scalable plasma processes for MoS2, which is crucial for enabling complementary circuits based on 2D semiconductors.