Abstract
Copper matrix composites reinforced with bimodal diamond particles were prepared via pressure infiltration. The effects of diamond particles mixing mode on the microstructure and thermal conductivity of the composites were analyzed. The heat flux vector distributions of the composites with or without the secondary diamond were simulated using finite element models based on the experimental microstructure images. The results show that the thermal conductivity of Diamond/Cu composites under different diamond particle mixing schemes all exceeded 700 W/mK. The obtained maximum thermal conductivity of Diamond/Cu composite is 853 W/mK when 25 vol% of secondary diamond particles with a particle size ratio of 10 were introduced. Such a result is explained by the optimization effect of secondary diamond particles on heat conduction channel and interfacial thermal resistance. Furthermore, the simulation results also prove that the introduction of secondary diamond can effectively improve the heat flux conduction along the diamond reinforced phase.
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