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Abstract
A novel double sided silicon interposer for low impedance power delivery is presented. In this letter, a model for power ground planes in inhomogeneous dielectrics with conductive subsections using the multi-layered finite difference method (M-FDM) is presented. Benefits of the silicon interposer in mitigating signal integrity issues arising due to return path discontinuities (RPDs) are also discussed for the first time along with a comparison to glass interposer.
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