Abstract
The continuous miniaturization of semiconductor requires the realization of 3D-IC. One promising way to achieve 3D-IC is through full-intermetallic microbumps. To implement the bonding structure, the strength of the joint should be improved. In this study, the elemental distribution, microstructure and grain structure of intermetallic in thermocompression-bonded microbumps were characterized by electron microscopy. Through grain refinement and c-axis diversification in thermocompression bonding, the improved die shear strength of Zn-doped joints was demonstrated.
Full Text
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call