Enhancement of upward thermal dissipation in a 16-Chip LED package using ceramic barrier ribs

Abstract

To enhance the upward thermal dissipation characteristics in a 16-chip light emitting diode (LED) package, ceramic barrier ribs were introduced between the LED chips. A FLIR T-250 IR microscopy camera was used to measure the top surface temperature of the package, which decreased from 116°C to 112°C at 2.5W operation because of the ceramic barrier ribs. A finite volume method simulation was conducted to estimate the temperature distribution inside the package, including the junction temperature. This simulation showed that the junction temperature decreased from 119°C to 114°C because of the barrier ribs. This result occurred because the ceramic barrier ribs provided a more effective upward heat dissipation path for the mid-chips, which contributed to the decrease in the junction temperature.