Enhancement of Thermal Transfer Efficiency on Electronic Equipment with Robust Copper Oxide Layer on Copper Substrate

Abstract

Electrodeposition and oxidation heat treatment were used for robust copper oxide layer on copper substrate to enhance the thermal transfer efficiency of electronic devices. The electrodeposition solution was modified to obtain rough and robust surface from copper ion concentration control compared to conventional electrodeposition solution. And oxidation heat treatment was optimized to formed dense copper oxide layer such as Cu2O and CuO. Fourier transform infrared spectroscopy (FT-IR) was used to measure the emissivity for thermal radiation performance at 50 ℃. Laser flash analysis (LFA) and Differential scanning calorimetry (DSC) were utilized to measure thermal diffusivity and specific heat capacity, respectively, thereby thermal conductivity of each specimen was calculated. Adhesion strength of deposited layer was evaluated by adhesion test and compared to general copper oxide layer which easily removed. In addition, the heat dissipation performance of specimen was evaluated with light emitting diode (LED) module. The electrodeposited copper substrate was attached to the LED module and directly estimated heat dissipation that applied actual devices. In conclusion, the modified electrodeposition and oxidation heat treatment surface on copper substrate shows a significant improvement of the thermal transfer performance due to enhanced thermal diffusivity and thermal radiation property.