Enhancement of Thermal Boundary Conductance of Metal-Polymer System.

Susanne Sandell,Clivia M Sotomayor Torres,Jianying He,Zhiliang Zhang,Helge Kristiansen,Jeremie Maire,Emigdio Chávez-Ángel

doi:10.3390/nano10040670

Susanne Sandell, Clivia M Sotomayor Torres + Show 5 more

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https://doi.org/10.3390/nano10040670

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In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic–inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal–polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1–15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal—either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal–polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 106 W·m−2·K−1 to 115 × 106 W·m−2·K−1, while the nickel layer increased TBC to 139 × 106 W·m−2·K−1. These results shed light on possible strategies to improve heat transport in organic electronic systems.

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Today, electronics are embedded in our lives through the use of smartphones, computers and the internet, and this will only continue through the staggering development in artificial intelligence, wearable electronics and the Internet of Things
Metal–polymer interfaces will only increase in number as organic electronics develops further and the thermal boundary resistances will contribute significantly to the total thermal resistance, leading to ever-growing issues for thermal management of these devices
We show that the thermal boundary conductance (TBC) of an Au–Polymethyl methacrylate (PMMA) interface can be enhanced by a factor of two by adding a Ti or Ni nanofilm at the interface

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Introduction

Electronics are embedded in our lives through the use of smartphones, computers and the internet, and this will only continue through the staggering development in artificial intelligence, wearable electronics and the Internet of Things. The PMMA layer must be thin enough that the measured conductivity κeff is sensitive to the TBC, instead of being dominated by the bulk contribution. Which is the characteristic thickness of a film of bulk thermal conductivity κ that gives the same thermal resistance as an interface of TBC G.

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