Abstract
Nano-silver paste is considered one of the most promising interconnection materials for high-power and high-temperature applications owing to its excellent electrical and thermal properties and low bonding temperature. However, sintered silver joints have several critical issues, including high porosity, poor wettability, and poor high-temperature reliability in air. In this study, we report that these problems can be resolved by introducing indium into the sintered silver joints. To support these claims, the microstructures and die shear strengths after bonding and high-temperature aging at 300 °C in air of both sintered nano-silver joints and sintered silver-indium joints are reported. The fracture surfaces after die shear tests are also analyzed. With the addition of indium, the porosity of the sintered joint decreases substantially, and the wettability improves considerably. Most importantly, the oxidation at high temperature is no longer an issue. The die shear strengths remain higher than 40 MPa even after aging at 300 °C in air for 1000 h.
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