Enhancement of mechanical properties of carbon fiber reinforced thermoplastic using colloidal techniques

Abstract

The composite using thermosetting resin, such as epoxy resin, as matrix was difficult to be recycled. The mechanical properties of the composite materials were deeply involved with the surface adhesion between the raw materials. Our attention was paid to the interfacial properties between the materials in the composite. To enhance the mechanical properties of the thermoplastics reinforced by carbon fibers, the surface adhesion between them should be improved. First, polymer colloids including the same components as the thermoplastic resin were synthesized through the soap-free emulsion polymerization, or using thermoplastic powder and surfactant. These polymer particles were adsorbed on the carbon fibers by electrodeposition. The amount of the adsorbed particles on carbon fibers were controllable with the applied voltage. The surface adhesion between the modified carbon fiber and thermoplastic resin were evaluated to measure the interfacial shear strength thorough the fragmentation test. As a result, interfacial shear strength was enhanced as the amount of the adsorbed particles increased. Using the modified carbon fibers, carbon fiber reinforced thermoplastic was prepared through hot press method with short reaction time. To investigate the mechanical properties of the carbon fiber reinforced thermoplastic, the three-point bending tests were carried out. Because the surface adhesion between carbon fibers and thermoplastic resin, such as poly(methyl methacrylate) or nylon, was improved using the colloidal techniques, the mechanical properties of the carbon fiber reinforced thermoplastic was also enhanced. Thus, the carbon fiber reinforced thermoplastic with high performance was synthesized with the fundamental colloidal techniques. Carbon fiber reinforced thermoplastic is expected to be used as the contractual and recyclable materials in the field of automobiles to realize the sustainable development.