Abstract

One facile approach to synthesize colorless polyimide (PI) film with enhanced dimensional stability and optical transparency is presented. With the optimum weight ratio of cosolvent GBL/DMAc, the PI film demonstrates the highest thermal stability and optical transparency. A further improvement in dimensional stability and optical transparency is achieved by blending silica sol and coupling agent in PI solution. The PI-50wt%SiO2 film exhibits a low coefficient of thermal expansion of 26 ppm/°C, high optical transmittance at 550 nm of 90.1%, and an ultra-low yellow index less than 1.4, indicating its potential application as substrate material in advanced microelectronic applications. [Supplementary materials are available for this article. Go to the publisher's online edition of International Journal of Polymeric Materials and Polymeric Biomaterials for the SI Figures.]

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