Enhanced thermal resistance of phenolic resin composites at low loading of graphene oxide

Abstract

By incorporating graphene oxide (GO) into phenolic resin (PR), GO/PR composites were prepared, and the effects of the content and reduction degree of GO on thermal resistance of GO/PR composites were studied. The peak degradation temperature of the PR was increased by about 14°C with GO which was heat treated. The char yield of GO/PR composite at a GO weight fraction of 0.5% was about 11% greater than that of PR. The interactions such as covalent bonds and π–π stacking between GO and PR were regarded as the main reason for the enhancement. Located at the GO–PR interface, GO effectively anchored and structured PR molecular near the surfaces of GO sheets, and thus facilitated the formation of char. The superiority of GO/PR composites over PR in terms of thermal properties enhancement should also be related to the promoting graphitization by the addition of GO.