Abstract
In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.
Highlights
The different needs of customers, whether domestic or work-related, have led to the constant advancement in electronics applications; one example is the pursuit of a continual increase in processing speed, which implies an increase in the connection density [1]
With the rapid growth of this technology, the electronic components have progressively achieved increasing levels of processing speed [3]. These improvements have resulted in an increase in heat flux from electronic devices, owing to the large amount of heat generated during the operation of electronic devices [4,5,6]
Numerous studies and experience have demonstrated that the stability of electronic devices is directly affected by a rise in operating temperature owing to heat accumulation, which reduces the lifespan of the device [7]
Summary
The different needs of customers, whether domestic or work-related, have led to the constant advancement in electronics applications; one example is the pursuit of a continual increase in processing speed, which implies an increase in the connection density [1] This constant development has resulted in the miniaturization of transistors, enabling more transistors to be attached and combined into a single device, leading to superior performance. To enhance the use of fillers, the formation of continual heat pathways in the matrix by synergizing the properties of different materials and creating a 3D thermal conductive structure is a beneficial way to decrease the thermal resistance of the filler–matrix interface, increasing the thermal conductivity. The impact of the hybrid filler on the enhancement of the epoxy resin was investigated by analyzing different properties, such as thermal conductivity, infrared thermal imaging, coefficient of thermal expansion, glass transition temperature, decomposition temperature, and electrical properties
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