Abstract

Light-matter interplay is widely used for analyzing the topology of surfaces on small scales for use in areas such as nanotechnology, nanoelectronics, photonics, and advanced materials. Conventional optical microscope imaging methods are limited in resolution to a value comparable to the wavelength, the so-called Abbe limit, and cannot be used to measure nano-sized structures. Scatterometry and Mueller ellipsometry are spectroscopic optical methods that can measure structures smaller than the wavelength. However, the relative uncertainties of the structure dimensions measured with scatterometry increase with decreasing structure size, and the industry is therefore replacing simple intensity based scatterometry with Mueller ellipsometry for the most demanding measurements. The accuracy of Mueller ellipsometry and scatterometry are closely related to the ability of the employed regression and regularization algorithms to extract the structural dimension. In this work, we demonstrate how the measurement accuracy on three-dimensional periodic structures may be increased by measuring the same periodic structure with multiple techniques and applying a χ2-regression method that finds the best solution based on the input from all the instruments. We furthermore report on a new and improved calibration method for Mueller ellipsometry and demonstrate how the Mueller matrix may be used to find the geometrical anisotropy of the structure.

Highlights

  • Nanostructures have a wide array of applications in optics, diagnostics, food science, sensing, and process inspection monitoring

  • The importance of hybrid metrology was discussed as a method for precision measurements of two dimensional periodic structures

  • We have presented and demonstrated the use of new and improved formulas for high precision Mueller ellipsometry

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Summary

Introduction

Nanostructures have a wide array of applications in optics, diagnostics, food science, sensing, and process inspection monitoring. Some of these applications include enhancing waveguide coupling, improving linear encoders, making hyperspectral cameras and printing color images [1,2,3,4]. Imaging technologies like Optical Microscopy (OM), Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM) are the dominating quality assesment technologies in low volume, high-cost nanoscale manufacturing, whereas scatterometry and Mueller ellipsometry are the preferred technologies for high volume manufacturing. Scatterometry and Mueller ellipsometry can measure the shape of periodic

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