Abstract
SummaryHigh power impulse magnetron sputtering (HIPMS) has emerged as a useful approach for depositing highly dense and smooth coatings of electrically conductive materials. Recent advances in power supply technology have further enabled HIPMS through the addition of a positive kick in the pulse cycle which supplies a bias at the surface of the sputter target which expels sputter target ions and sends more charged adatoms toward the substrate. This has been demonstrated with critical materials like diamond‐like carbon and plasmonic materials. Material specific pulse magnitudes and durations can be developed to achieve new novel thin film morphologies.
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