Abstract
ABSTRACTSmall amounts of copper were added to enhance the adhesion and minimize agglomeration of Ag thin films on SiO2 substrates. Comparison of texture profiles between Ag and Ag(Cu) thin films showed that Cu additions enhanced (111) texture in Ag thin films. For the case of Ag film, (111) texture was enhanced mainly by recrystallization of amorphous regions during annealing. In addition to the recrystallization, (111) texture enhancement in Ag(Cu) film attributes to the dissociation of grains with other crystallographic orientations.
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