Abstract
The use of polymeric membrane-based ISFETs in solution requires a method of encapsulating the package while leaving the gates of the chip open for a subsequent membrane deposition. The choice of encapsulants and the method are governed by the general device package, by the geometry and layout of the chip and by the intended use. In view of this, there seems to be no universal recipe for encapsulation. Two examples of the ISFET encapsulation approach described in this paper are an adaptation of the tape authomated bonding process and a dry film photoresist wafer encapsulation. Both of these processes, when fully developed, permit some degree of automation in the ISFET assembly.
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