Abstract
Application of photocurable polymers for encapsulation of ion selective field effect transistors (ISFET) and for membrane formation in chemical sensitive field effect transistors (ChemFET) during the last 20 years is discussed. From a technological point of view these materials are quite interesting because they allow the use of standard photo-lithographic processes, which reduces significantly the time required for sensor encapsulation and membrane deposition and the amount of manual work required for this, all items of importance for sensor mass production. Problems associated with the application of this kind of polymers in sensors are analysed and estimation of future trends in this field of research are presented.
Highlights
The field of chemical sensors based on microelectronic devices has been the topic of considerable research in the last decades and has been largely focused on ion selective field effect transistors
The response mechanisms of ion selective field effect transistors (ISFET)-based sensors are based on the electrochemical phenomena occurring within the chemically sensitive membrane placed on top of the transistor gate [1] and on electrical transduction of the signal by this semiconductor device
To exploit the advantages offered by modern technologies in a fabrication of solid-state chemical sensors based on ISFETs new requirements are imposed on any potential matrix for ion sensor membranes, namely the adhesion of membranes to a solid substrate and the compatibility of any ion-sensitive membrane deposition process with microelectronic technology
Summary
The field of chemical sensors based on microelectronic devices has been the topic of considerable research in the last decades and has been largely focused on ion selective field effect transistors This interest arises from certain advantages of ISFETs over conventional ion-selective electrodes (ISE) such as a small size and solid nature, short response times and low output impedance and the possibility of mass fabrication. Other features such as the integration of compensation and data processing circuits in the same chip offered new perspectives for these sensors. The use of photocured polymeric systems permits one to employ a standard photolithographic process, which reduces significantly the time of membrane deposition and facilitates the encapsulation process reducing the manual work required for it, items that are all important for sensor mass production
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