Abstract
A method for the direct photolithographic structuring of epoxy resins has been elaborated and applied to the encapsulation of CHEMFETs. The experimental results promise the possibility of a high degree of automation in CHEMFET production. This process may also be used for the encapsulation of other sensors (e.g., pressure or gas sensors) which need a window in the encapsulation material between the sensor chip and the measuring medium.
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