Composite organic encapsulate film with epoxy and benzoxazine

Abstract

Electronic devices based on organic materials readily degrade owing to moisture or oxygen. Encapsulation materials and films made of inorganic and organic materials have been studied to arrest degradation, and polymeric materials have become more desirable owing to their flexibility, transparency, and processability. In this study, polymeric composite films that are fabricated under atmospheric conditions are studied. The composite encapsulation films consist of a combination of bisphenol A phenoxy resin and epoxy resin (POL) and synthesized benzoxazine monomer (eugenol-based Eu-Bzo (EZ), bisphenol-S based BPS-SA-Bzo (PZ), and bisphenol-AF based BPAF-SA-Bzo (FZ)). The composite with benzoxazine exhibits superior barrier characteristics with a highly hydrophobic nature compared to POL. The composite film with 3% Eu-Bzo exhibits lower moisture permeation rate of 2.02 g m−2 d−1 with 90% transparency in comparison to POL (3.65 g m−2 d−1) and PET (4.25 g m−2 d−1). The novel composition of epoxy and phenoxy resins along with benzoxazine is a potential candidate for fabricating barrier materials for flexible printed organic electronics.