Abstract
Potted electronics are becoming more common in precision-guided artillery-launched munitions and also missile systems due to the requirements for miniaturization and structural-robustness. In this paper we have presented a methodology for encapsulating circuit board assemblies (CBA) with a thin polymer layer. The protective polymer layer is both flexible and soft enough to protect the CBA from damage caused by CTE mismatches, and without any appreciable degradation in the structural support during the high-g forces of projectile launch. The application process described here allows for the use of a broad range of polymer materials including those that may not be formed directly against an actual CBA. Proof-of-concept experimental tests and finite-element simulations have been performed and the tests and simulation results are shared in this paper. In addition, the protective polymer layer can also be used to improve in-circuit board crosstalk and RF interference shielding, tin-whisker growth control, moisture barrier properties, and thermal management for un-potted and potted CBAs.
Published Version
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