Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology

Abstract

Technology challenges and solutions in the development and manufacturing of stacked silicon interconnect (SSI) technology have been investigated with the established foundry and outsourced semiconductor assembly and test ecosystem. Key enabling technologies, such as through-silicon-via processing, interposer backside manufacturing yield enhancement, new stacking technology, interposer warpage control, and microbump processes and joining, which are the building blocks for SSI technology, were developed. Xilinx's 28-nm field programmable gate array with an SSI technology platform was used to develop and optimize the seamless integration of the processes, structures, and parameters, as well as to evaluate their yield, reliability, and device performance.