Abstract
This article consists of a collection of slides from the author's conference presentation. Presents the product design and applications supported by Xilinx stacked silicon interconnect (SSI) technology. Identifies the economics drivers and technical challenges the company faces to develop its SSI products/services. Discusses the progression and development of three-dimensional (3D) technolgies. Also examines capacity planning; FPGA technologies for SSI development; and future market opportunties.
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