Abstract
The increasing reliance on electronic devices has created a pressing demand for high-performance and sustainable electromagnetic interference shielding materials. While conventional materials, such as metals and carbon-based composites, offer excellent shielding capabilities, they are hindered by high costs, environmental concerns, and limitations in scalability. Polysaccharide-based materials, including cellulose, chitosan, and alginate, represent a promising alternative due to their biodegradability, renewability, and versatility. These materials, when combined with advanced fillers such as MXene, graphene, silver nanowires (AgNW), carbon nanotubes (CNTs), and magnetic nanoparticles like Fe3O4, exhibit exceptional shielding performance, often exceeding 100 dB, alongside lightweight and flexible characteristics. A detailed bibliometric analysis reveals a rapid growth in global research, with China leading in publication output and international collaborations. Advances in composite design, such as multilayered, gradient, and hybrid architectures, have significantly enhanced the functional capabilities of these materials, including improved absorption-reflection mechanisms, thermal management, and mechanical robustness. Despite these achievements, key challenges persist in optimizing filler dispersion, balancing electrical and mechanical properties, and developing scalable production methods. This review offers critical insights into the untapped potential of underexplored polysaccharides, such as starch and gums, and highlights their suitability for next-generation EMI shielding applications. By exploring the synergy between various fillers and polysaccharide matrices, the article outlines transformative pathways for creating high-performance, sustainable materials. Readers are equipped with actionable perspectives on innovative composite designs, material optimization strategies, and scalable fabrication techniques to address the evolving demands of advanced electronics and environmental sustainability.
Published Version
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