Abstract
This paper deals with the possibility of passive SMD (Surface Mount Devices) components’ (capacitors and resistors) embedding into the PCB (Printed Circuit Board) in a vertical way. SMD components with the package 0201 have been placed into several kinds of via with different diameters. Fort this reason, the impact of the hole diameter (0.4 and 0.45 mm), solder paste, way of dispensing and applied soldering process on to the final quality have been analyzed. The special PCBs containing several vias with different diameters and technologies of manufacturing have been designed, manufactured and tested. After the component placing and soldering process, the metallographic sections have been realized and investigated. The results show the possibility of embedding the SMD passives into the microvia. This paper offers a detailed description of the recommended technological steps needed for achieving the 100% success rate of creating a reliable embedded SMD component.
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