Abstract
Today's System on Chip (SoC) is being incorporated with digital, analog, radio frequency, photonic and other devices [1]. More recently, sensors, actuators, and biochips are also being integrated into these already powerful SoCs. On one hand, SoC integration has been enabled by advances in mixed system integration and the increase in the wafer sizes (currently about 300 mm and projected to be 450mm by 2018 [1]). Consequently, the cost per chip of such SOCs has reduced. On the other hand, support for multiple capabilities and mixed technologies has increased the cost of ownership of advanced foundries. For instance, the cost of owning a foundry will be $5 billion in 2015 [2]. Consequently, only large commercial foundries now manufacture such high performance, mixed system SoCs especially at the advanced technology nodes [3].
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