Abstract
Abstract The packaging technology plays a critical role in the development of environmentally robust microelectronic systems. There is great demand for microelectronic systems that can withstand harsh environments and high temperatures in numerous applications including down-hole drilling, geothermal drilling, aerospace, heavy industrial, and automotive industries. In these applications, both sensors and interface electronics could be subjected to temperatures of 200°C and beyond. Standard plastic or epoxy based printed circuit boards are not reliable at these temperatures for long term operation. Packaging techniques such as Low Temperature Co-fired Ceramic (LTCC) offer a versatile and reliable alternative to form electronic substrates. LTCC is a multi-layer packaging system that also provides the ability to embedded passive components, such as resistors and capacitors, and thermal management structures within the substrate. This work evaluates the performance of LTCC embedded passive elements from 25°C to 225°C. A variety of passive component designs are evaluated using theoretical calculations, simulations, and measurements of fabricated test structures.
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