Elevated-temperature etching of gallium nitride (GaN) in dual-frequency capacitively coupled plasma of CH4/H2 at 300–500 °C

Abstract

Elevated-temperature etching with CH4/H2 plasma chemistry at 300 °C improves damage-less optical properties of GaN, solving issues of degradation on near-band-edge photoluminescence intensity on plasma etching at lower temperatures than 300 °C. Damage-less etching properties in a smooth surface, high photoluminescence intensity, and substantial stoichiometric ratio of gallium and nitrogen were obtained when the CH4/H2 chemistry with substrate temperatures at 300–500 °C.