Electronic Components Thermal Stability Analysis of PCB Plate Based on the Micro Unit Heat Balance Method

Abstract

In the thermal stability analysis of electronic equipment, usually we obtain the temperature by quasi circuit method and analytic method. Quasi circuit method is to use the method of circuit analysis, and the heat flux in electronic equipment is simulated into current value in short circuit analysis. The temperature is simulated into a voltage of the circuit. The values of conductance and resistance are simulated into some other valued of circuit components. Analytical method is set space function subordinate relationship value of temperature in electronic equipment. Usually these two methods are desirable, but in the actual design, due to the large computational quantity of quasi circuit method and analytic method, the calculation is complex. Therefore, we combine these methods to solve some traditional disadvantages using micro unit heat balance method, which provides a new method for optimal portfolio.