Abstract

In the semiconductor industry electron beam testing has become an indispensable tool for chip verification during the design phase of integrated circuits and for failure analysis. Due to the fact that the e-beam may be influenced in many different ways, e.g. scanning, pulsing, synchronizing, a wide variety of e-beam testing techniques have been developed in the last twenty years. Some of these techniques have found widespread application and are available in commercial e-beam testers (EBT). This paper gives an overview of the different techniques and discusses their capabilities and limitations.

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