Abstract
Electron beam testing is used as a tool for chip verification during the design phase and in failure analysis. A brief description is given of what the designer of failure analyst needs to know about the electron probe and signal processing. Five main modes of operation are explained in detail: voltage coding, logic-state mapping, frequency tracing, frequency mapping and waveform measurement. The components which transform a scanning electron microscope into an electron beam tester are discussed. Electron beam test technology is treated in detail, especially integrated test systems consisting of electron beam tester, IC tester, and CAD system. Three generalized examples illustrate the methodology of chip verification during the design phase. Current trends and limitations of future applications of electron beam testing are discussed.
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