Electromigration Resistance of Electroplated Gold Thin Films Used for Fine Bumps as a Strong Function of the Crystallinity of Grain Boundaries

Genta Nakauchi, Hideo Miura

https://doi.org/10.1299/jsmeth.2021.56.119_paper

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Publication Date: Jan 1, 2021

Abstract

Electromigration Resistance of Electroplated Gold Thin Films Used for Fine Bumps as a Strong Function of the Crystallinity of Grain Boundaries

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