Abstract
Electromigration (EM) is a major failure mode in electronic interconnections, which is commonly made of Ag, Cu, and their alloys. Herein, a single- and two-phase AgCu alloys were subjected with current density of 4 × 105 A/cm2 for in situ microstructural and crystallographic characterizations. Anomalous grain growth and the formation of cord-like grains with an aspect ratio over 1000 and asymmetrical hillock/voids clusters were found. These abnormal morphological evolutions were resulted from the electron flow-induced lattice strains, which was inversely correlated with the lifespan of interconnection. Multi-phase alloys are less resistant to EM due to the unbalanced electron flow-induced strains.
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