Electromigration-driven shape evolution of two-dimensional voids

Abstract

We present a detailed numerical study of the electromigration-induced shape evolution of quasi-two-dimensional (cylindrical) voids in metallic thin films. The problem is treated within a continuum formulation which takes into account mass transport along surfaces, current crowding, and crystal anisotropy in the surface mobility. Finite strips with periodic boundary conditions in the current direction are treated as well as voids in infinite or semi-infinite films. For the strip geometry, it is shown that the linear instability of the strip edge can induce the release of voids into the interior of the film, while edge voids develop into fatal slits only in the presence of moderate (not too strong) crystalline anisotropy. Distorted voids in an infinite film typically disintegrate, but the breakup scenario is qualitatively different in isotropic and anisotropic media. A rigid boundary attracts voids and may also induce void breakup.