Abstract
Advancement in electronic and communication technologies bring us up to date, but it causes electromagnetic interference (EMI) resulting in failure of building and infrastructure, hospital, military base, nuclear plant, and sensitive electronics. Therefore, it is of the utmost importance to prevent the failure of structures and electronic components from EMI using conducting coating. In the present study, Cu, Cu-Zn, and Cu-Ni coating was deposited in different thicknesses and their morphology, composition, conductivity, and EMI shielding effectiveness are assessed. The scanning electron microscopy (SEM) results show that 100 µm coating possesses severe defects and porosity but once the thickness is increased to 500 µm, the porosity and electrical conductivity is gradually decreased and increased, respectively. Cu-Zn coating exhibited lowest in porosity, dense, and compact morphology. As the thickness of coating is increased, the EMI shielding effectiveness is increased. Moreover, 100 µm Cu-Zn coating shows 80 dB EMI shielding effectiveness at 1 GHz but Cu and Cu-Ni are found to be 68 and 12 dB, respectively. EMI shielding effectiveness results reveal that 100 µm Cu-Zn coating satisfy the minimum requirement for EMI shielding while Cu and Cu-Ni required higher thickness.
Highlights
The development of electronics and communication technologies cause us to advance but they adversely affect the building and infrastructure, hospital, military base, nuclear plant, and sensitive electronics owing to the augmentation in electromagnetic interference (EMI)
The coating thickness obtained by scanning electron microscopy (SEM) images are in good agreement with the result measured by Elcometer456
Cu, Cu-Zn, and Cu-Ni coatings were deposited by the arc thermal spray process in various thicknesses to shield the EMI, and their properties were assessed by SEM, X-ray diffraction (XRD), electrical conductivity, and EMI shielding effectiveness
Summary
The development of electronics and communication technologies cause us to advance but they adversely affect the building and infrastructure, hospital, military base, nuclear plant, and sensitive electronics owing to the augmentation in electromagnetic interference (EMI). The electronic science and technology cause electromagnetic radiation, which is the fifth most prevalent pollution after air, water, noise, and solid waste of the world [1]. It affects the aforementioned structures and human health [2,3,4]. It is of the utmost importance to prevent the damages of structures caused by electronic devices from the EMI. It can be achieved by shielding the surrounding structure using mechanically and electrically conducting materials. The electrical conductivity of the shielding materials can be obtained by mixing with carbon or highly conductive metals [5,6,7,8,9]
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