Abstract

2.5-Dimensional integration based on glass interposer technology is a potential means of achieving high-bandwidth and high-integration density electrical systems. Ultra-low loss glass substrate enables high-frequency signaling but this low loss substrate is vulnerable to the noise suppression in the power distribution network (PDN). Electromagnetic Band-gap (EBG) structures in the PDN are well-known techniques to suppress the PDN noise. We first designed and fabricated EBG structures in the glass interposer PDN and analyzed effectiveness of these EBG structures for the noise suppression in the PDN.

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