Abstract
The metal-oxide-silicon light-emitting diode under biaxial tensile mechanical strain is studied. The emission line shape of the device can be fitted by the electron-hole-plasma recombination model. The energy gap of strained Si extracted by the light emission spectra at the temperature of 120 K is reduced by 15 meV under 0.13% biaxial tensile strain. The light intensity of the device under 0.13% biaxial tensile strain increases 9% as compared to the relaxed-Si device. The upshift of valence band edge under mechanical strain to increase the majority hole concentration at the oxide∕Si interface may be responsible for this light emission enhancement. The mechanical strain is measured by Raman spectroscopy, strain gauge, and analyzed by the finite element method.
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