Abstract
Electrodeposition of NiP film used as a thin nonmagnetic spacer in laminated multilayer (2.4T CoFe/NiP)n perpendicular writer pole is described. The electrodeposition of laminated multilayers was carried out in a dual-bath automated electroplating tool. The thin NiP films with thicknesses from 2.0 to 20 nm were obtained as nonmagnetic amorphous alloys with P-content higher than 18 at%. The problem of a concentration gradient at the CoFe/NiP interface, i.e. a lower P-content in the NiP deposit within a distance of 10 nm from the CoFe-interface, was solved by using STI-1 Proprietary organic additive in the plating solution. The details of the electrodeposition of NiP films and their properties are described.
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