Enhanced electrodeposition of indium hexacyanoferrate thin films through improved plating solution stability

Abstract

An ordinary plating solution for indium hexacyanoferrate (InHCF) thin film deposition, mainly composed of equal concentrations of In3+ and [Fe(CN)6]3–, usually forms precipitates rapidly when either concentration is higher than few millimolar. This contributes to the plating solution's instability. Moreover, electrodeposited capacities are limited accordingly. In this work, the plating solution's stability and the electrodeposition of InHCF were greatly enhanced by adding a large amount of K+ and/or H+. It was found that a 10-mM plating solution added with 1 M HCl and 1 M KCl could be stored as fresh over a one-week period, whereas an unmodified plating solution became useless within a couple of minutes. Also, such cationic additions, especially adding H+, increased the electrodeposited capacity ca. 18 times at least, as compared with that obtained from the unmodified plating solution. Furthermore, related enhancing mechanisms were proposed and verified. To sum up, this study offers a means for better InHCF electrodeposition and should promote the applications of InHCF films.