Abstract
A highly conductive electrolytic nickel–phosphorus (Ni–P) plating bath was formulated as an alternative to electroless Ni–P deposition for aluminium wire bonding application. The Ni–P deposits were electroplated from nickel citrate baths containing sodium chloride, citric acid, nickel sulphate and sodium hypophosphite (SHP) using the DC plating. In comparison with Watts bath, the formulated highly conductive citrate bath had almost twice of cathodic current efficiency in low-current density regions and exhibited more uniform plating thickness. In addition, the formulated citrate bath did not have any boric acid as a component; and hence, eliminating the waste disposal issue related to boric acid.
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