Abstract
Carbonous nanomaterials are promising additives for composite coatings for heat-dissipation materials because of their excellent thermal conductivity. Here, copper/carbonous nanomaterial composite coatings were prepared using nanodiamond (ND) as the carbonous nanomaterial. The copper/ND composite coatings were electrically deposited onto copper substrates from a continuously stirred copper sulfate coating bath containing NDs. NDs were dispersed by ultrasonic treatment, and the initial bath pH was adjusted by adding sodium hydroxide solution or sulfuric acid solution before electrodeposition. The effects of various coating conditions—the initial ND concentration, initial bath pH, stirring speed, electrical current density, and the amount of electricity—on the ND content of the coatings were investigated. Furthermore, the surface of the NDs was modified by hydrothermal treatment to improve ND incorporation. A higher initial ND concentration and a higher stirring speed increased the ND content of the coatings, whereas a higher initial bath pH and a greater amount of electricity decreased it. The electrical current density showed a minimum ND content at approximately 5 A/dm2. Hydrothermal treatment, which introduced carboxyl groups onto the ND surface, improved the ND content of the coatings. A copper/ND composite coating with a maximum of 3.85 wt % ND was obtained.
Highlights
Heat management has recently become a major issue in the electronics industry because of the continuous miniaturization of devices
Copper and its alloys have been widely used in the electronics industry as heat-dissipation materials because of its excellent thermal conductivity [3,4,5]
Heat-dissipation materials with higher thermal conductivities are required for future electronics that will operate at much higher power densities
Summary
Heat management has recently become a major issue in the electronics industry because of the continuous miniaturization of devices This miniaturization has led to increased power densities; effective heat removal is important to maintain and improve their performance [1,2,3]. Heat-dissipation materials with higher thermal conductivities are required for future electronics that will operate at much higher power densities. Carbonous materials such as graphite, graphene, carbon nanofibers, carbon nanotubes, and diamonds are promising candidates for next-generation heat-dissipation materials because their thermal conductivity is 2 to 10 times greater than that of copper [3,5,6,7,8,9,10]. Various monolithic carbonous materials, including synthetic graphite sheets [6], graphite foams [8], a vertically aligned hybrid material of diamond thin platelets covered with a crystalline graphite layer [9], and highly oriented
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
