Electrodeposition of Co–Ni–Cu/Cu multilayers: 1. Composition, structure and magnetotransport properties

Abstract

Co–Ni–Cu/Cu multilayers have been deposited from a sulfate/sulfamate bath by controlling the current and the potential for the deposition of the magnetic and the copper layer, respectively. The magnetic layer thickness was varied between 1.2 nm and 12 nm, while the Cu layer thickness was in the range of 1.1–2.3 nm. Alloys with direct current have also been produced for comparison. All multilayer deposits exhibited a face centered cubic structure, while a small amount of hexagonal close packed phase was also present in the d.c. deposited alloys. The composition analysis showed that the codeposition of Co and Ni can be classified as anomalous codeposition for both d.c. and compositionally modulated deposits, regardless of the simultaneous deposition of Cu. The composition of the magnetic layer was affected by its layer thickness. This finding led to the conclusion that there must be a composition gradient in the magnetic layer in the growth direction. The magnetoresistance of the multilayers increased with increasing copper layer thickness, while the superparamagnetic contribution in the magnetoresistance increased with decreasing deposition current density of the magnetic layers.