Electrodeposited Copper Wire Mesh Formed on Chromium Template, the Formation Mechanism and Application as a Transparent Conductive Film

Abstract

Copper wire mesh electrodeposits have been formed along the cracks of an electrodeposited chromium template. By reducing the electrodeposition time, the open area ratio increased and wire width of the copper wire decreased. The electrodeposited copper wire mesh has an 84.0% transmittance, 9.8 μm wire width and 0.187 Ω/□ sheet resistance. These characteristics satisfy some practical use requirements of a transparent conductive film. The copper wire mesh electrodeposits initiate at the crack edges. These initial deposits, which form along the crack edge, combine and then form the copper wire mesh. The copper deposition initiated at sites along the crack edges. As electrodeposition progressed, growth from the initiation sites coalesced to give copper wire formation along the crack edges. It eventually forms a spherical cross section shape along the crack. The initial deposit formation along the crack edge is due to the current incubation removal of the local oxide film preferentially along the chromium template crack edges.