Abstract

Cobalt chloride and neodymium chloride were dissolved in the urea and choline chloride deep eutectic solvents (DESs), and the electrochemical mechanisms of Co-Nd alloy codeposition were investigated under ambient conditions. Results from cyclic voltammetry indicated that the deposition of metallic Co on the tungsten electrode proceeds by an apparent two-electron transfer irreversible process at − 1.02 V (vs Ag). It is impossible to deposit pure Nd in urea and choline chloride DESs, whereas Co-Nd alloys can be codeposited from electrolytes with both Co(II) and Nd(III) ions. Furthermore, chronoamperometric experiments demonstrated that the electrochemical deposition of metallic Co can be considered as a three-dimensional (3-D) progressive nucleation process, while Co-Nd alloys were formed by instantaneous nucleation with diffusion-controlled growth. The average value of the diffusion coefficient of Co(II) ions in the urea and choline chloride DESs containing 3.8 × 10−5 mol/cm3 CoCl2 at 373 K was calculated to be 1.98 × 10−7 cm2/s. Moreover, analysis by scanning electron microscopy and energy dispersive X-ray spectroscopy suggested that a flat and uniform film consisting of Co (96.26 wt pct) and Nd (3.74 wt pct) was prepared by electrodeposition on a Cu substrate.

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