Abstract
Copper nanoparticles (narrowly dispersed in diameter) were electrochemically prepared in the 33.3-66.7% mole fraction (m/o) choline chloride (ChCl)-urea based deep eutectic solvent. The copper source was introduced into the solvent by dissolution of Cu(I) oxide (Cu2O). The study was performed by means of cyclic voltammetry and constant voltage electrolysis, and the electrodeposits were characterized by X-ray diffraction (XRD), energy dispersive X-ray spectroscopy (EDS), transmission electron microscope (TEM), and particle size analyzer (PSA). Cyclic voltammogram analysis exhibited that the electrodeposition of copper in the deep eutectic solvent was a diffusion-controlled quasi-reversible process with a relatively low diffusion coefficient of 9.78×10- 8 cm2 s-1. Depended on the voltage applied, the as-prepared copper particle size was evaluated as 28±7 and 57±6 nm at 2.5 and 2.2 V, respectively. It’s expected that the ChCl–urea based deep eutectic solvent has the potential to replace the traditional hydrogen evolution suffered aqueous baths for preparation of copper nanoparticles.
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