Abstract
The initial stages of Cu electrodeposition onto fluor-tin-oxide (FTO) coated glass and n-Si(1 0 0) substrates from sulfate solutions containing respectively 5 × 10 −3 M CuSO 4, 1 M Na 2SO 4 and 0.5 M H 3BO 3 are studied using cyclic voltammetry and chronoamperometry and the Scharifker–Hills model is used to analyse the current transients. For electrodeposited Cu on both FTO and n-Si(1 0 0) electrodes, the nucleation is in a good agreement with the instantaneous nucleation and three-dimensional (3D) diffusion-limited growth. The values of kinetic parameters, number density of active sites N 0, and diffusion coefficient D for Cu 2+ ions are also calculated.
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