Abstract
Abstract In this work, we studied the electrodeposition of copper (Cu) microparticles on polypyrrole (PPy) films using cyclic voltammetry and chronoamperometry techniques. The initial stages of Cu deposition were investigated by performing current transients. Models based on Scharifker and Hills calculations were established to determine the nucleation and growth type. The results suggest that the deposition of Cu proceeds via an instantaneous nucleation followed by three-dimensional (3D) diffusion-limited growth. The values of the number density of active sites N∞ and diffusion coefficient D were also determined.
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